Wafer Laser Grooving Machine adopts customized wafer dicing-specific laser(Ns&Ps options), 2-dimensional platform for linear motor, closed-loop CNC system and high-resolution CCD positioning techn...

Backside wafer marking machine,  using a high-precision positioning platform and closed-loop CNC system and being equipped with high- resolution CCD positioning techniques and AOI detection, mark...

Laser drilling machine features a high-precision platform structure and customized laser design, with enhanced efficiency with HBC. It uses high-resolution CCD positioning technology, high-speed and p...

Frontside wafer marking machine, using a high-precision positioning platform and closed-loop CNC system and equipped with high-resolution CCD positioning technique and AOI detection, marks wafer on it...

Wafer nondestructive dicing machine uses customized inner silicon dicing laser with both penetration rate and focus quality ensured. With high-speed air floating platform, closed-loop CNC system and h...

Wafer ID marking machine using a high-precision positioning platform and closed-loop CNC system and equipped with high-resolution CCD positioning technique and AOI detection, marks wafer ID for automa...

Slitting machine adopts a high-precision platform structure and customized laser system. It also incorporates high-resolution CCD to ensure better stability. Laser has E-plus function to keep pulse en...

The strip marking machine adopts the "double galvo + double platform" design and a customized laser system, which can enhance marking efficiency and support various marking contents includin...