Product Center
Wafer Drilling Machine

Laser drilling machine features a high-precision platform structure and customized laser design, with enhanced efficiency with HBC. It uses high-resolution CCD positioning technology, high-speed and precision linear motor and closed-loop CNC system, and support drilling and scribing processes. Laser has E-plus function to keep pulse energy stable in highly dynamic process. The product has an independent intellectual property.

Product advantages
Compatible with 8' and 12' wafers
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Min hole diameter: 15um, light beam trimming is adjustable, small hole edge smooth, with no heat impact or burrs
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Configured with CCD pre-scanning, mark point and contour positioning functions
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Modular design, with each component customization on demand
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