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Product catalog

Photovoltaic

Perovskite laser scribing machine
Automatic TOPCon Laser Doping machine

Semiconductor Industry

Wafer Laser Grooving Machine
Backside Wafer Marking Machine
Wafer Drilling Machine
Frontside Wafer Marking Machine
Wafer Nondestructive Dicing Machine
Wafer ID Marking Machine
Slitting Machine
Strip Marking Machine

Micro-LED

Laser Lift-Off(LLO) Equipment
Mass Transfer
Wafer Trimming

Consumer Electronics

FPC Laser Drilling
PCB Drilling Machine

Display Panel

Automatic OLED Cutting Machine
OLED Flexible Panel Cutting Machine
Automatic LCD Pol Cut Machine
LCD Laser Terminal Short-circuit Cutting Machine
Laser Marking Machine
Color Film Laser Etching Machine
Defect repair, automatic measuring

New Energy Industry

Pancake Dedusting Machine
Laser Notching & Slitting Machine
Laser Notching and Winding Machine
Explosion-proof Valve Welding Machine
Pole Laser Welding Machine
Lid Welding Leak Test Machine
Collector Laser Welding Machine
Lid Laser Welding Machine
Tab Laser Welding Machine
Seal Pin Laser Welding Machine

Backside Wafer Marking Machine

Backside wafer marking machine, using a high-precision positioning platform and closed-loop CNC system and being equipped with high- resolution CCD positioning techniques and AOI detection, marks wafer on its backside. Wafer is loaded/unloaded automatically. And the machine has an independently-owned intellectual property.

Product advantages

Vision accuracy: ±10um; platform positioning repeatibility: ±5um; whole machine accuracy: ±50um

Single head efficiency surpasses that of average duplex heads by even 50%，compatible with 8-/12-inch Foup, Cassette

Equipped with wafer smoothing unit for soft wafer marking, and high-precision hardware for wafer warping≤12mm

Laser: green laser; fan cooling; modular design