Product Center
Wafer Trimming

Wafer trimming machine takes advantage of the company's experience in laser industry and incorporate multiple laser making techiques. The use of lasers of multiple wavelength meets requirements of different scenarios and products. Fine wafer trimming is achieved to ensure wafer quality.

Product advantages
Customized platform for flexible applications
1
Highly compatible, compatible with chips with over 15' size
2
Wide application, appliable to different products
3