Lead laser has been invited to participate in the SEMICON2023 that attracted world's leading equipment and materials manufacturers in the field of semiconductor manufacturing, bringing with the core laser solution and cutting-edge laser equipment to communicate with audiences and interactive sharing.

Lead laser displayed the latest generation of the wafer laser grooving/full cut machine, which attracted various visitors to carefully listen to the detailed introduction of the star equipment by technicians. 

▲Wafer laser grooving/full cut machine

• Suitable for LG of materials such as Low-k, AlN, Cu, Al, etc.

• Suitable for laser full cut of materials such as Si, GaAs, etc.

• 8/12 inch compatible, supporting Ns / Ps options.

• Dual path multi beam processing.

• Continuous adjustable grooving width：10-90 µm.

• Processing ultra narrow street within 10μm.

• Overall accuracy ：＜±1µm

Lead laser as the leading corporation, was invited to give a speech. Mr. Hor, the vice general manager of Lead Laser spoke the theme of Laser Application and Challenges in Semiconductor Advance Heterogeneous Packaging at the seminar. 

The three-day industry expo ended successfully on July 1 at the Shanghai New International Expo Center, and Lead Laser will continue to forge ahead, delve into core technologies, research and development, continuously optimize product processes, and bring first-class laser solutions to the world!