PCB, known as the "mother of electronic products", is a key electronic interconnection that enables various electronic components to form a predetermined circuit connection. In the PCB family, FPC (flexible circuit board) is a key member, widely used in smart phones, tablet PCs, wearable devices, smart automobiles and other intelligent terminals. With the arrival of the 5G era and the era of smart automobiles, FPC market demand envisions a significant increase.
FPC drilling is the main process stage of FPC forming. The quality of micro-holes directly affects the mechanical assembly performance and electrical connection of FPC. Besides, drilling process accounts for up to 35% of the production cost. As electronic products continue to develop in the direction of becoming lighter, thinner, shorter and smaller, FPC is correspondingly developed in the direction of high density. The number of micro-holes on the same layer of FPC can reach more than 50,000. These large number of micro-holes impose requirements for more advance drilling technologies.
In this context, Lead Laser takes the lead in applying HBC (optical control module) into FPC drilling machine. This greatly improves FPC drilling efficiency and through-hole and blind hole quality, fills the technology gap in domestic FPC laser drilling industry, and makes Lead FPC laser drilling machine enter the world's upper echelon of players.
Ultra-high speed drilling, heralding a new era for HBC
Lead Laser’s HBC (High Speed Optical Control Module) technology is researched and designed for more than two years by a team of professional optical/electronic engineers, with full proprietary intellectual property rights.
Through application of HBC technology, the FPC laser drilling machine truly realizes single pulse energy control, laser processing point control and spot size control. Its ultra-fast speed and the ability to control the processing point arbitrarily untangle from the limitations of many mechanical parts and open up a new direction of PCB ultra-high speed drilling.
Leading Process
For 50um hole, Lead Laser’s HBC system can speed up 3-4 times compared to that of the traditional scanner drilling, and maintain hole true roundness >95%.
The HBC system can control light spot size, eliminating the glue clearing step in the traditional processing of blind holes, thus completing blind hole drilling in one step.
The HBC system is the first in China to adopt six-axis linkage technology, and is ahead of similar manufacturers in Japan and S.Korea to make way into mass production.
Ultra-high roundness to ensure premium product quality
Generally speaking, with the increase of drilling speed and acceleration, as well as the gradual reduction of hole diameter, it will be more and more difficult to guarantee product true roundness by the traditional scanner drilling process.
Lead Laser’s HBC system is free from this mechanical limitation. And the new technology makes it possible to obtain a uniform and consistent light spot after laser focusing, thus ensuring the processing effect. Even under conditions of 50um holes and a speed of 1500+mm/s, Lead Laser’s FPC drilling machine can still drill high-precision and high-quality micro holes.
Through-hole/blind hole sample
Double-sided boards through-hole
Double-sided boards blind hole
Multi-sided boards blind hole
